Systems And Methods For Assessing The Quality Of Adhesive Bonds

Systems And Methods For Assessing The Quality Of Adhesive Bonds

In one embodiment, assessing the quality of an adhesive bond of a composite material includes passing a vector electric field through a thickness of the composite material, measuring dielectric properties of the composite material, determining one or more dielectric parameters of the composite mater...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Raihan, Md Rassel, Reifsnider, Kenneth L, Vadlamudi, Vamsee, Dave, Chaitanya, Elenchezhian, Muthu Ram Prabhu, Banerjee, Priyanshu Kumar
Format: Patent
Sprache:eng
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:In one embodiment, assessing the quality of an adhesive bond of a composite material includes passing a vector electric field through a thickness of the composite material, measuring dielectric properties of the composite material, determining one or more dielectric parameters of the composite material, and comparing the one or more dielectric parameters with one or more reference dielectric parameters.