LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Sampei, Takashi, Masuda, Yukiyasu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.