ELECTRONIC ASSEMBLY THAT INCLUDES A SUBSTRATE BRIDGE

The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Goh, Penang, Teoh, Hoay Tien, Ong, Jenny Shio Yin, Go, Jia Yan
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package; a second memory module mounted to the printed circuit board; and a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.