VACUUM CHAMBER ARRANGEMENT

According to various embodiments, a vacuum chamber arrangement can have the following: a vacuum chamber, which has a first supply passage; a substrate holding arrangement having a substrate holder for holding and positioning at least one substrate, a vacuumtight supply housing for supplying the subs...

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Bibliographische Detailangaben
Hauptverfasser:	Gottsmann, Lutz, Melcher, Jens, Laimer, Georg
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	According to various embodiments, a vacuum chamber arrangement can have the following: a vacuum chamber, which has a first supply passage; a substrate holding arrangement having a substrate holder for holding and positioning at least one substrate, a vacuumtight supply housing for supplying the substrate holder with at least one supply medium, wherein the supply housing has a second supply passage; a bearing arrangement, by means of which the substrate holding arrangement is supported movably within the vacuum chamber; and a supply hose, which links the first supply passage to the second supply passage.