CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

A circuit board structure and its forming method are provided. The circuit board structure includes a dielectric layer and a first wiring layer embedded in the dielectric layer. The first wiring layer includes a plurality of conductive contact pads exposed on the upper surface of the dielectric laye...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ma, Ming-Chieh, Lin, Cheng-Hsieng, Wang, Sheng-Ping, Liu, Yin-Chih
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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