CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

A circuit board structure and its forming method are provided. The circuit board structure includes a dielectric layer and a first wiring layer embedded in the dielectric layer. The first wiring layer includes a plurality of conductive contact pads exposed on the upper surface of the dielectric laye...

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Bibliographische Detailangaben
Hauptverfasser:	Ma, Ming-Chieh, Lin, Cheng-Hsieng, Wang, Sheng-Ping, Liu, Yin-Chih
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A circuit board structure and its forming method are provided. The circuit board structure includes a dielectric layer and a first wiring layer embedded in the dielectric layer. The first wiring layer includes a plurality of conductive contact pads exposed on the upper surface of the dielectric layer. The circuit board structure also includes a plurality of metal pillars. Each of the metal pillars is formed on and is in direct contact with one of the conductive contact pads. The circuit board structure also includes a first insulating passivation layer and a second insulating passivation layer formed on the upper surface and the lower surface of the dielectric layer. The first insulating passivation layer includes a first opening exposing the metal pillars and the conductive contact pads, and the second insulating passivation layer includes a second opening.