BUMP BASE REINFORCEMENT SHEET

Provided is a bump base reinforcement sheet with which it is possible, even for a solder bump with a large diameter, to reinforce a base portion on a primary mounting substrate side and to achieve good electrical connection with a secondary mounting substrate. The bump base reinforcement sheet compr...

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Bibliographische Detailangaben
Hauptverfasser:	Shiga, Goji, Iino, Chie
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a bump base reinforcement sheet with which it is possible, even for a solder bump with a large diameter, to reinforce a base portion on a primary mounting substrate side and to achieve good electrical connection with a secondary mounting substrate. The bump base reinforcement sheet comprises a base material sheet and a thermosetting resin sheet that is laminated on the base material sheet. The thickness t [μm] of the base material sheet and the minimum melt viscosity η [Pa・s] at 50 to 180°C of the thermosetting resin sheet satisfy the following relational expression: 150 ≤ t・η ≤ 100000.