INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME

An integrated circuit device may include a substrate including a main surface, a compound semiconductor nanowire extending from the main surface in a first direction perpendicular to the main surface and including a first section and a second section alternately arranged in the first direction, a ga...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Cantoro, Mirco, Heo, Yeon-cheol, Toledano Luque, Maria
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit device may include a substrate including a main surface, a compound semiconductor nanowire extending from the main surface in a first direction perpendicular to the main surface and including a first section and a second section alternately arranged in the first direction, a gate electrode covering the first section, and a gate dielectric layer between the first section and the gate electrode. The first section and the second section may have the same composition as each other and may have different crystal phases from each other