PRODUCING METHOD OF SUSPENSION BOARD WITH CIRCUIT ASSEMBLY

A method for producing a suspension board with circuit assembly includes a preparing step of preparing a plurality of board assemblies each of which includes a plurality of suspension boards with circuit including a first terminal, a supporting portion collectively supporting the plurality of suspen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAKAKURA, Takatoshi, KANAGAWA, Hitoki
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A method for producing a suspension board with circuit assembly includes a preparing step of preparing a plurality of board assemblies each of which includes a plurality of suspension boards with circuit including a first terminal, a supporting portion collectively supporting the plurality of suspension boards with circuit, and a plurality of connecting portions connecting each of the suspension boards with circuit to the supporting portion; an assembly disposing step of disposing the plurality of board assemblies on a carrier board; a solder disposing step of disposing a first solder on the first terminal; an element disposing step of disposing an electronic element so as to be in contact with the first solder; and a reflow step of heating the first solder to be dissolved and connecting the electronic element to the first terminal. The solder disposing step, the element disposing step, and the reflow step are continuously performed.