CIRCUIT BOARD MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD MODULE

According to one embodiment, an electronic device includes housing, a circuit board in the housing, a semiconductor package, and a support plate on a second surface of the circuit board. The support plate is arranged at a position corresponding to a corner of the first area and includes a main porti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Hayashiyama, Shinya, Shimizu, Akihisa
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	According to one embodiment, an electronic device includes housing, a circuit board in the housing, a semiconductor package, and a support plate on a second surface of the circuit board. The support plate is arranged at a position corresponding to a corner of the first area and includes a main portion, a first projecting portion in contact with the main portion at a first side of the main portion, and a second projecting portion in contact with the main portion at a second side of the main portion. The first projecting portion and the second projecting portion are arranged such that an imaginary line connecting a corner of the first projecting portion and a corner of the second projecting portion is outside the main portion.