ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME

An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion confi...

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Bibliographische Detailangaben
Hauptverfasser:	Aoki, Mikio, Mikata, Jin, Ito, Taiji, Kitazaki, Kenzo, Kai, Takehiko, Shimamura, Masaya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.