SEMICONDUCTOR MODULE

A semiconductor module includes a metal substrate having a mounting surface, a first conductive plate on the mounting surface, an insulating substrate on the first conductive plate, a second conductive plate on the insulating substrate, a conductive pad on the insulating substrate, a semiconductor element on the second conductive plate, a circuit board electrically connected to the conductive pad, a resin case connected to the metal substrate and extending along at least a portion thereof, and around the first conductive plate, the insulating substrate, the second conductive plate, the conductive pad, the semiconductor element, and the circuit board, and a silicone gel in a region bounded by the metal substrate and the resin case. The circuit board comprises a plurality of planar surfaces oriented perpendicular to the mounting surface of the metal substrate.