Multilayer Wiring Board and Differential Transmission Module
A multilayer wiring board having a first layer and a second layer laminated with a ground conductor, respectively, and having a differential wire line configured with a first wire line and a second wire line, includes a pair of through-holes and which is formed in the first layer and the second laye...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!