Multilayer Wiring Board and Differential Transmission Module

A multilayer wiring board having a first layer and a second layer laminated with a ground conductor, respectively, and having a differential wire line configured with a first wire line and a second wire line, includes a pair of through-holes and which is formed in the first layer and the second laye...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NISHIMURA, Kei, KOGO, Kenji
Format: Patent
Sprache:eng
Schlagworte:
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