Multilayer Wiring Board and Differential Transmission Module

A multilayer wiring board having a first layer and a second layer laminated with a ground conductor, respectively, and having a differential wire line configured with a first wire line and a second wire line, includes a pair of through-holes and which is formed in the first layer and the second laye...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIMURA, Kei, KOGO, Kenji
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION WAVEGUIDES
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Beschreibung
Zusammenfassung:	A multilayer wiring board having a first layer and a second layer laminated with a ground conductor, respectively, and having a differential wire line configured with a first wire line and a second wire line, includes a pair of through-holes and which is formed in the first layer and the second layer and electrically connects the first wire line and the second wire line arranged on one surface of the multilayer wiring board and the first wire line and the second wire line arranged on the other surface of the multilayer wiring board, respectively; and clearances and which insulate the ground conductor and the through-holes and, in which the pair of through-holes formed in the second layer is arranged so that a virtual line connecting centers of the pair of through-holes is inclined with respect to a line perpendicular to a signal propagation direction of the differential wire line.