RF RESONATORS AND FILTERS

A filter package comprising an array of piezoelectric films sandwiched between an array of upper electrodes and lower electrodes: the individual piezoelectric films and the upper electrodes being separated by a passivation material; the lower electrode being coupled to an interposer with a first cav...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Hurwitz, Dror
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A filter package comprising an array of piezoelectric films sandwiched between an array of upper electrodes and lower electrodes: the individual piezoelectric films and the upper electrodes being separated by a passivation material; the lower electrode being coupled to an interposer with a first cavity between the lower electrodes and the interposer; the filter package further comprising a silicon wafer of known thickness attached over the upper electrodes with an array of upper cavities between the silicon wafer and a silicon cover; each upper cavity aligned with a piezoelectric film in the array of piezoelectric films, the upper cavities having side walls comprising the passivation material.