METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE

METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE

A method of producing a multi-layer ceramic substrate includes the steps of: (A) preparing a first ceramic green sheet with a thermal expansion layer arranged thereon, and at least one second ceramic green sheet with no thermal expansion layer arranged thereon; (B) laminating the first and second ce...

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Hauptverfasser: IKEDA, Hatsuo, MASUKAWA, Junichi
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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creator IKEDA, Hatsuo
MASUKAWA, Junichi
description A method of producing a multi-layer ceramic substrate includes the steps of: (A) preparing a first ceramic green sheet with a thermal expansion layer arranged thereon, and at least one second ceramic green sheet with no thermal expansion layer arranged thereon; (B) laminating the first and second ceramic green sheets with the thermal expansion layer sandwiched therebetween, thereby obtaining a green sheet laminate; (C) pressure-bonding together the ceramic green sheets of the green sheet laminate; (D) heating and thereby expanding the thermal expansion layer in the pressure-bonded green sheet laminate; (E) extracting a portion of the green sheet laminate that has been displaced the expansion of the thermal expansion layer, thereby forming a cavity in the green sheet laminate; and (F) sintering the green sheet laminate with the cavity formed therein.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2018277395A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2018277395A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2018277395A13</originalsourceid><addsrcrecordid>eNrjZDD1dQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNX8A31CfH0cYx0DVJwdg1y9PV0VggOdQoOCXIMceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhhZG5ubGlqaOhsbEqQIAsRso_Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE</title><source>esp@cenet</source><creator>IKEDA, Hatsuo ; MASUKAWA, Junichi</creator><creatorcontrib>IKEDA, Hatsuo ; MASUKAWA, Junichi</creatorcontrib><description>A method of producing a multi-layer ceramic substrate includes the steps of: (A) preparing a first ceramic green sheet with a thermal expansion layer arranged thereon, and at least one second ceramic green sheet with no thermal expansion layer arranged thereon; (B) laminating the first and second ceramic green sheets with the thermal expansion layer sandwiched therebetween, thereby obtaining a green sheet laminate; (C) pressure-bonding together the ceramic green sheets of the green sheet laminate; (D) heating and thereby expanding the thermal expansion layer in the pressure-bonded green sheet laminate; (E) extracting a portion of the green sheet laminate that has been displaced the expansion of the thermal expansion layer, thereby forming a cavity in the green sheet laminate; and (F) sintering the green sheet laminate with the cavity formed therein.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180927&amp;DB=EPODOC&amp;CC=US&amp;NR=2018277395A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180927&amp;DB=EPODOC&amp;CC=US&amp;NR=2018277395A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IKEDA, Hatsuo</creatorcontrib><creatorcontrib>MASUKAWA, Junichi</creatorcontrib><title>METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE</title><description>A method of producing a multi-layer ceramic substrate includes the steps of: (A) preparing a first ceramic green sheet with a thermal expansion layer arranged thereon, and at least one second ceramic green sheet with no thermal expansion layer arranged thereon; (B) laminating the first and second ceramic green sheets with the thermal expansion layer sandwiched therebetween, thereby obtaining a green sheet laminate; (C) pressure-bonding together the ceramic green sheets of the green sheet laminate; (D) heating and thereby expanding the thermal expansion layer in the pressure-bonded green sheet laminate; (E) extracting a portion of the green sheet laminate that has been displaced the expansion of the thermal expansion layer, thereby forming a cavity in the green sheet laminate; and (F) sintering the green sheet laminate with the cavity formed therein.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD1dQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNX8A31CfH0cYx0DVJwdg1y9PV0VggOdQoOCXIMceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhhZG5ubGlqaOhsbEqQIAsRso_Q</recordid><startdate>20180927</startdate><enddate>20180927</enddate><creator>IKEDA, Hatsuo</creator><creator>MASUKAWA, Junichi</creator><scope>EVB</scope></search><sort><creationdate>20180927</creationdate><title>METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE</title><author>IKEDA, Hatsuo ; MASUKAWA, Junichi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2018277395A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>IKEDA, Hatsuo</creatorcontrib><creatorcontrib>MASUKAWA, Junichi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IKEDA, Hatsuo</au><au>MASUKAWA, Junichi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE</title><date>2018-09-27</date><risdate>2018</risdate><abstract>A method of producing a multi-layer ceramic substrate includes the steps of: (A) preparing a first ceramic green sheet with a thermal expansion layer arranged thereon, and at least one second ceramic green sheet with no thermal expansion layer arranged thereon; (B) laminating the first and second ceramic green sheets with the thermal expansion layer sandwiched therebetween, thereby obtaining a green sheet laminate; (C) pressure-bonding together the ceramic green sheets of the green sheet laminate; (D) heating and thereby expanding the thermal expansion layer in the pressure-bonded green sheet laminate; (E) extracting a portion of the green sheet laminate that has been displaced the expansion of the thermal expansion layer, thereby forming a cavity in the green sheet laminate; and (F) sintering the green sheet laminate with the cavity formed therein.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
title METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T14%3A00%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IKEDA,%20Hatsuo&rft.date=2018-09-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2018277395A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true