LATERAL VIAS FOR CONNECTIONS TO BURIED MICROCONDUCTORS AND METHODS THEREOF
The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimens...
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| creator | Grubbs, Robert K Fishgrab, Kira L Silverman, Scott Henry, Michael David Greth, Karl Douglas Hodges, V. Carter Shul, Randy J Adams, David P Goeke, Ronald S Stevens, Jeffrey |
| description | The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | LATERAL VIAS FOR CONNECTIONS TO BURIED MICROCONDUCTORS AND METHODS THEREOF |
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