LATERAL VIAS FOR CONNECTIONS TO BURIED MICROCONDUCTORS AND METHODS THEREOF

LATERAL VIAS FOR CONNECTIONS TO BURIED MICROCONDUCTORS AND METHODS THEREOF

The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimens...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Grubbs, Robert K, Fishgrab, Kira L, Silverman, Scott, Henry, Michael David, Greth, Karl Douglas, Hodges, V. Carter, Shul, Randy J, Adams, David P, Goeke, Ronald S, Stevens, Jeffrey
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.