Thermoplastic Compositions Containing Nanoscale-Sized Particle Additives For Laser Direct Structuring and Methods For the Manufacture and use Thereof

Thermoplastic Compositions Containing Nanoscale-Sized Particle Additives For Laser Direct Structuring and Methods For the Manufacture and use Thereof

This invention relates generally to a thermoplastic compositions and, more particularly, to compositions comprising a polymer matrix and comprising a filler composition. To that end, according to the aspects of the invention, a thermoplastic composition is disclosed that generally comprises a polyme...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yan, Yangang, Cheng, Yunan, Wu, Tong
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
ELECTRICITY
INSULATORS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:This invention relates generally to a thermoplastic compositions and, more particularly, to compositions comprising a polymer matrix and comprising a filler composition. To that end, according to the aspects of the invention, a thermoplastic composition is disclosed that generally comprises a polymer matrix and at least one filler composition. The polymer matrix generally comprises at least one polycarbonate or polyamide. The filler composition generally comprises at least one laser direct structuring additive with a mean particle size of less than 1 μm and may additionally optionally comprise flame retardants, stabilizers and process aids.