Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board

Such a metal foil is provided that a release layer is provided on a metal foil to enable physical release of a resin substrate, to which the metal foil is adhered, and thereby in the step of removing the metal foil from the resin substrate, the metal foil can be removed with good cost without damagi...

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Bibliographische Detailangaben
Hauptverfasser:	Ishii, Masafumi, Moriyama, Terumasa
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	Such a metal foil is provided that a release layer is provided on a metal foil to enable physical release of a resin substrate, to which the metal foil is adhered, and thereby in the step of removing the metal foil from the resin substrate, the metal foil can be removed with good cost without damaging the surface profile of the metal foil transferred to the surface of the resin substrate, and also resins having different resin components can be adhered with good adhesion. A metal foil containing, on at least one surface of the metal foil, surface unevenness having a root mean square height Sq of from 0.25 to 1.6 μm.