WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

A wiring board includes an insulating substrate, mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, and terminal electrodes arranged to face each other on a second main surface of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KAWASAKI, Kouichi, MURAKAMI, Kensaku, MORIYAMA, Yousuke
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A wiring board includes an insulating substrate, mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, and terminal electrodes arranged to face each other on a second main surface of the insulating substrate along another pair of opposing sides of the insulating substrate in a perspective plan view.