PRINTED CIRCUIT BOARD AND MOBILE TERMINAL MOUNTED THE SAME

There is disclosed a mobile terminal comprising a printed circuit board, a chipset comprising a die and connected to the printed circuit board through BGA (Ball Grid Array), and a solder pad array provided in a predetermine region of the printed circuit board, corresponding to the BGA, wherein the s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Kipyoung, KIM, Kipoung, CHO, Youngmin, LEE, Youngjik
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS TELEPHONIC COMMUNICATION TRANSMISSION
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Beschreibung
Zusammenfassung:	There is disclosed a mobile terminal comprising a printed circuit board, a chipset comprising a die and connected to the printed circuit board through BGA (Ball Grid Array), and a solder pad array provided in a predetermine region of the printed circuit board, corresponding to the BGA, wherein the solder pad array comprises a NSMD array region provided in a region corresponding to the die and having NSMD pads and a SMD array region provided in an outer region of the NSMD array region and having SMD pads, to solve the disadvantages in impact resistance or heat resistance which might be generated in the chipset mounted printed circuit board structure.