CENTERING SUBSTRATES ON A CHUCK

An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sens...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Adderly, Shawn A, Moon, Matthew D, DiStefano, Samantha D, Lifson, Max L, Gambino, Jeffrey P, Sullivan, Timothy D, Levy, Max G
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.