SUBSTRATE PROCESSING APPARATUS

The substrate processing apparatus includes first supply piping which guides a processing liquid from a first branching portion to a first chemical liquid nozzle, first return piping which guides the processing liquid from the first branching portion to a tank, a first pressure-loss setting unit whi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	OKUYA, Yosuke
Format:	Patent
Sprache:	eng
Schlagworte:	ACTUATING-FLOATS BASIC ELECTRIC ELEMENTS BLASTING CLEANING CLEANING IN GENERAL COCKS DEVICES FOR VENTING OR AERATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TAPS THERMAL INSULATION IN GENERAL TRANSPORTING VALVES WEAPONS
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Beschreibung
Zusammenfassung:	The substrate processing apparatus includes first supply piping which guides a processing liquid from a first branching portion to a first chemical liquid nozzle, first return piping which guides the processing liquid from the first branching portion to a tank, a first pressure-loss setting unit which sets a pressure loss so that a pressure loss through the first supply piping is larger than a pressure loss through the first return piping, and a first discharge valve which switches between a first discharge execution state in which the pressure loss through the first return piping is larger than the pressure loss through the first supply piping and a first discharge stop state in which the pressure loss through the first return piping is smaller than the pressure loss through the first supply piping.