CONNECTING ARRANGEMENT FOR THE ADHESIVE CONNECTION OF A POSITIONALLY SENSITIVE ELEMENT TO A RECEIVING BODY

A bonding arrangement and a method for the adhesive bonding of a position-sensitive element to a receiving body, in particular of an optical element, such as a semiconductor light source, a reflector, or the like, wherein a UV-curable adhesive is arranged between the position-sensitive element and t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SIMONE, Rohrberg, SCHUERHOFF, Konrad
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BLASTING CHEMISTRY DYES HEATING LIGHTING MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL NON-PORTABLE LIGHTING DEVICES PAINTS POLISHES SYSTEMS THEREOF USE OF MATERIALS AS ADHESIVES VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A bonding arrangement and a method for the adhesive bonding of a position-sensitive element to a receiving body, in particular of an optical element, such as a semiconductor light source, a reflector, or the like, wherein a UV-curable adhesive is arranged between the position-sensitive element and the receiving body. Provision is made that the bond between the position-sensitive element and the receiving body has at least one cavity for accommodating the UV-curable adhesive and at least one retaining element that extends into the cavity and projects into the UV-curable adhesive. The cavity has a bottom section that is designed to be sufficiently thin-walled that the adhesive can be cured with UV light that can be radiated through the bottom section.