DEVICE AND METHOD FOR TEMPERING SECTIONS OF METAL COMPONENTS

A device and method for tempering sections of hot-formed and/or press-hardened metal components is disclosed having a support structure and a work head, the work head having at least one contact element consisting of an electrically-conductive material, for heating sections of a metal component using a flow of heat. Electrodes for resistively heating the contact element are connected thereto, and to a current source. A hot-formed and/or press-hardened metal component is first provided, and at least one contact element mounted on a work head is heated to a temperature greater than a target temperature to which a section of the metal component is to be heated. A contact surface of said contact element then comes into full-surface contact with the metal component section to be heated, with a predetermined pressing force, such that the metal component is heated to a target temperature in at least some sections by a flow of heat. The contact element is thus heated using resistive heating.