SILICON NITRIDE SINTERED BODY WITH HIGH THERMAL CONDUCTIVITY AND METHOD FOR MANUFACTURING SAME

Embodiments relate to a method for manufacturing a silicon nitride sintered body with high thermal conductivity, which includes the steps of: a) obtaining a slurry by mixing a silicon nitride powder and a non-oxide based sintering aid; b) obtaining a mixed powder by drying the slurry; c) forming a c...

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Bibliographische Detailangaben
Hauptverfasser: SEOG, In Sig, KIM, Do Kyung, LEE, Hyun Min, LEE, Eun Bok
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments relate to a method for manufacturing a silicon nitride sintered body with high thermal conductivity, which includes the steps of: a) obtaining a slurry by mixing a silicon nitride powder and a non-oxide based sintering aid; b) obtaining a mixed powder by drying the slurry; c) forming a compact by pressurizing the mixed powder; and d) sintering the compact.