SUBSTRATE VACUUM FORMING MOLD AND METHOD

A vacuum forming mold includes a cavity and a vacuum suction opening communicating with the cavity. The vacuum suction opening is provided in a sidewall surface of the cavity, such that air inside the cavity below a substrate is sucked out through the sidewall surface. A vacuum forming method includ...

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Bibliographische Detailangaben
Hauptverfasser: Chae, Kyubong, Jee, Hong-Keun
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A vacuum forming mold includes a cavity and a vacuum suction opening communicating with the cavity. The vacuum suction opening is provided in a sidewall surface of the cavity, such that air inside the cavity below a substrate is sucked out through the sidewall surface. A vacuum forming method includes seating a substrate on the vacuum forming mold and subsequently sucking out air inside the cavity below the substrate through the vacuum suction opening, such that the air is sucked out through the sidewall surface.