METHOD OF MANUFACTURING SUBSTRATE STRUCTURE

METHOD OF MANUFACTURING SUBSTRATE STRUCTURE

A method of manufacturing a substrate structure includes providing a first substrate including a first device region on a first surface, providing a second substrate including a second device region on a second surface, such that a width of the first device region is greater than a width of the seco...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, Seok Ho, LEE, Ho Jin, MOON, Kwang Jin, KIM, Tae Yeong, KANG, Pil Kyu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of manufacturing a substrate structure includes providing a first substrate including a first device region on a first surface, providing a second substrate including a second device region on a second surface, such that a width of the first device region is greater than a width of the second device region, and bonding the first substrate and the second substrate, such that the first and second device regions are facing each other and are electrically connected to each other.