METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON

METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON

A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal interconnect layer which provides a plurality of bond pads that are coupled to circuit nodes on the IC device. The plurality of bond pads inclu...

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Bibliographische Detailangaben
Hauptverfasser: ZRILE, ROBERT, SCHACHTSCHNEIDER, KAI-ALEXANDER, OTTE, MICHAEL, WIESNER, HARALD, RINCK, HELMUT, BAUER, GERNOT
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal interconnect layer which provides a plurality of bond pads that are coupled to circuit nodes on the IC device. The plurality of bond pads includes a metal bond pad area. A cobalt including connection layer is deposited directly on the metal bond pad area. The cobalt including connection layer is patterned to provide a cobalt bond pad surface for the plurality of bond pads, and a solder material is formed on the cobalt bond pad surface.