SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE

This substrate processing method is a substrate processing method that processes a front surface of a substrate with using a processing liquid, including a mixture replacing step of replacing the processing liquid attached to the front surface of the substrate with a mixture of a first liquid and a...

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Bibliographische Detailangaben
Hauptverfasser:	OTSUJI, Masayuki, HONSHO, Kazuhiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	This substrate processing method is a substrate processing method that processes a front surface of a substrate with using a processing liquid, including a mixture replacing step of replacing the processing liquid attached to the front surface of the substrate with a mixture of a first liquid and a second liquid having a higher boiling point than that of the first liquid and a lower surface tension than that of the first liquid, and a mixture removing step of removing the mixture from the front surface of the substrate after the mixture replacing step.