ELECTRONIC DEVICE HAVING A GROOVED CHIP

ELECTRONIC DEVICE HAVING A GROOVED CHIP

An electronic device includes a support plate having a mounting face. An electronic chip has a front face mounted on the mounting face of the support plate. A rear face of the electronic chip located opposite to the front face is provided with rear grooves that define, between the grooves, rear zone...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Figuiere, Laurent, Lobascio, Gaetan, Mas, Alexandre
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device includes a support plate having a mounting face. An electronic chip has a front face mounted on the mounting face of the support plate. A rear face of the electronic chip located opposite to the front face is provided with rear grooves that define, between the grooves, rear zones. A rear layer made of a heat-conducting material is spread over the rear face of the electronic chip so as to at least partly cover the rear zones and at least partially fill the rear grooves.