SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND EQUIPMENT

A semiconductor apparatus includes a semiconductor substrate having an upper surface on which a semiconductor element is disposed, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface. The side surface has a plurality of concavities that each extend along the edge of the upper surface and that are arranged in a direction intersecting with the upper surface and the lower surface, and a plurality of ridges that are each located at the boundary between adjacent two of the plurality of concavities. The plurality of concavities and the plurality of ridges are covered with an insulating film containing carbon and fluorine.