HEAD MODULE AND LIQUID EJECTION APPARATUS

A head module includes a head, a driver IC, a heat spreader, a holder and a heat insulator. The head ejects liquid in response to the driver IC. The heat spreader is in thermal communication with the driver IC. The holder supports the head. The heat insulator is located to thermally isolate the heat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	SAKUMA, Susumu
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A head module includes a head, a driver IC, a heat spreader, a holder and a heat insulator. The head ejects liquid in response to the driver IC. The heat spreader is in thermal communication with the driver IC. The holder supports the head. The heat insulator is located to thermally isolate the heat spreader and the holder.