ELECTRONICS CHASSIS ASSEMBLY

A method and apparatus for heat-dissipation in an electronics chassis can include a housing having an interior and exterior, at least two walls, at least one of which is a thermally conductive wall, a heat spreader operably coupled to at least a portion of the housing to dissipate or spread heat fro...

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Bibliographische Detailangaben
Hauptverfasser:	Tiscareño Macias, Aquiles, Morales Rueda, Ramon, Hernandez Guerra, Diego, Herrera Velázquez, Armando, Pando Rodriguez, Luis Javier, Martínez Vargas, Jorge Alberto, Taboada Reyes, Federico, Mendoza Gómez, Luis Antonio
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	A method and apparatus for heat-dissipation in an electronics chassis can include a housing having an interior and exterior, at least two walls, at least one of which is a thermally conductive wall, a heat spreader operably coupled to at least a portion of the housing to dissipate or spread heat from a heat producing component.