FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES

Disclosed herein are fine-featured traces for integrated circuit (IC) package support structures, and related systems, devices, and methods. For example, a device may include a printed circuit board (PCB) having an insulating material and a heater trace on the insulating material. In some embodiment...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zhang, Zhichao, Xiao, Kai, Ouyang, Gong, Ferguson, Shelby, Aoki, Russell S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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