FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES

FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES

Disclosed herein are fine-featured traces for integrated circuit (IC) package support structures, and related systems, devices, and methods. For example, a device may include a printed circuit board (PCB) having an insulating material and a heater trace on the insulating material. In some embodiment...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Zhang, Zhichao, Xiao, Kai, Ouyang, Gong, Ferguson, Shelby, Aoki, Russell S
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed herein are fine-featured traces for integrated circuit (IC) package support structures, and related systems, devices, and methods. For example, a device may include a printed circuit board (PCB) having an insulating material and a heater trace on the insulating material. In some embodiments, the heater trace may have a section with a width less than 3.5 mils. In some embodiments, a section of the heater trace may be adjacent to a burned portion of the insulating material.