POLISHING EXTREMELY THIN SILICA SHEETS AND POLISHED SHEETS

POLISHING EXTREMELY THIN SILICA SHEETS AND POLISHED SHEETS

A method of manufacturing a sheet of fused silica includes polishing a sheet of fused silica having a thickness of less than 500 μm and a major face surface area of at least 6π square inches. The polishing is performed by removing less than 100 micrometers depth of material of a major surface of the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Bankaitis, Jonas, Mehrotra, Karan
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:A method of manufacturing a sheet of fused silica includes polishing a sheet of fused silica having a thickness of less than 500 μm and a major face surface area of at least 6π square inches. The polishing is performed by removing less than 100 micrometers depth of material of a major surface of the sheet, such as by bonding the sheet to a substrate, polishing a first major side of the sheet, debonding the sheet from the substrate, flipping the sheet, bonding the flipped sheet to the substrate or a new substrate, and polishing a second major side of the sheet. Prior to polishing, the sheet has a peak-to-valley waviness of at least 1 micrometer, but after polishing has peak-to-valley waviness less than 500 nanometers.