SEMICONDUCTOR PACKAGE

A semiconductor package includes a first device; a second device laterally adjacent to the first device; a molding member encapsulating the first device and the second device; and a lateral bump structure implementing a lateral signal path between the first device and the second device. A portion of...

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Bibliographische Detailangaben
1. Verfasser:	LIN, POUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A semiconductor package includes a first device; a second device laterally adjacent to the first device; a molding member encapsulating the first device and the second device; and a lateral bump structure implementing a lateral signal path between the first device and the second device. A portion of the molding member is disposed between the first device and the second device.