CUTTING TOOL INSERT

A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a...

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Bibliographische Detailangaben
Hauptverfasser: Liversage, John Hewitt, Goudemond, lain Patrick, Scott, Danny Eugene
Format: Patent
Sprache:eng
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Zusammenfassung:A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a pressure and temperature at which diamond is thermodynamically stable. The first PCD wafer is more thermally stable than the second PCD wafer.