WIRELESS MODULE AND METHOD FOR MANUFACTURING WIRELESS MODULE

A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAI, Takehiko, SHIMAMURA, Masaya, MIKATA, Jin, ITO, Taiji, AOKI, Mikio
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.