HIGH Q FACTOR INDUCTOR STRUCTURE

A three-dimensional (3-D) inductor is incorporated in a substrate. The 3-D inductor has a first connector plate, a second connector plate, a third connector plate, a first terminal plate, and a second terminal plate. Four multi-via walls connect the various plates, wherein each multi-via wall includ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Maxim, George, Leipold, Dirk Robert Walter, Moriuchi, Toshiaki, Scott, Baker
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A three-dimensional (3-D) inductor is incorporated in a substrate. The 3-D inductor has a first connector plate, a second connector plate, a third connector plate, a first terminal plate, and a second terminal plate. Four multi-via walls connect the various plates, wherein each multi-via wall includes a first group of at least three individual via columns, each of which connects two plates together.