ELECTRONIC DEVICE, MANUFACTURING METHOD AND LEAD FRAME FOR SAME

An electronic device has a first surface providing electrical contact points and multiple side surfaces surrounding the first surface. The electronic device includes a lead frame and a device die attached to the lead frame. The lead frame is located at a side of the first surface of the electronic d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fung, Yee Wai, Leung, Chi Ho, HOR, WAI HUNG, Xue, Ke
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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