ELECTRONIC DEVICE, MANUFACTURING METHOD AND LEAD FRAME FOR SAME

ELECTRONIC DEVICE, MANUFACTURING METHOD AND LEAD FRAME FOR SAME

An electronic device has a first surface providing electrical contact points and multiple side surfaces surrounding the first surface. The electronic device includes a lead frame and a device die attached to the lead frame. The lead frame is located at a side of the first surface of the electronic d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Fung, Yee Wai, Leung, Chi Ho, HOR, WAI HUNG, Xue, Ke
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device has a first surface providing electrical contact points and multiple side surfaces surrounding the first surface. The electronic device includes a lead frame and a device die attached to the lead frame. The lead frame is located at a side of the first surface of the electronic device, and is configured to provide solder pads on the first surface of the electronic device. A lead frame for the electronic device and a method for assembling the electronic device also are provided.