POLISHING PAD AND METHOD FOR MAKING THE SAME

The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of sec...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FENG, CHUNGIH, LIN, JHIH-GONG, LIN, CHIH-YI, FU, TAI-YUN, HUNG, YUNGANG, YAO, I-PENG
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of second fibers, a polymeric elastomer and a plurality of pores. The second fibers are arranged irregularly and cross each other to form the pores, and the polymeric elastomer is attached to the second fibers and does not fill the pores.