AEROSOL METHODS FOR MAKING CHEMICAL MECHANICAL PLANARIZATION (CMP) POLISHING PADS

The present invention provides methods for making CMP polishing pads or layers therefore, the methods comprising introducing, separately, to a static mixer having a nozzle at its downstream end two solvent free and substantially water free components, a liquid polyol component having a temperature T1 and a liquid isocyanate component having a temperature T2, each under a low gauge pressure of from 5 to 120 kPa (1 to 14 psi), the liquid polyol component comprising one or more polyol, an amine curative; and the liquid isocyanate component comprising one or more polyisocyanate or isocyanate-terminated urethane prepolymer; mixing the two components in the static mixer to form a reaction mixture, discharging a stream of the reaction mixture from the nozzle onto an open mold substrate having a urethane releasing surface, and curing to form a porous polyurethane reaction product.