ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity, a redistribution layer disposed adjacent to the frame and electrically connect...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, Jong Rip, LEE, Doo Hwan, KIM, Hyoung Joon, OH, Kyung Seob, SHIN, Ung Hui
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity, a redistribution layer disposed adjacent to the frame and electrically connected to the electronic component, and an encapsulation material encapsulating the electronic component and having an elastic modulus smaller than that of a material constituting the frame.