SEMICONDUCTOR MEMORY DEVICE

Provided herein is a semiconductor memory device. The semiconductor memory device may include channel layers protruding away from a substrate. The semiconductor memory device may include a plurality of pads respectively coupled to the channel layers. The widths of the pads may or may not be increase...

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Bibliographische Detailangaben
1. Verfasser: KIM, Yung Jun
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided herein is a semiconductor memory device. The semiconductor memory device may include channel layers protruding away from a substrate. The semiconductor memory device may include a plurality of pads respectively coupled to the channel layers. The widths of the pads may or may not be increased depending on a bending of the channel layers.