ARTICLES AND METHODS FOR BONDING SHEETS WITH CARRIERS

Described herein are organosilicon modification layers and associated deposition methods and inert gas treatments that may be applied on a sheet, a carrier, or both, to control van der Waals, hydrogen and covalent bonding between a sheet and carrier. The modification layers bond the sheet and carrie...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Adib, Kaveh, Bellman, Robert Alan
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Described herein are organosilicon modification layers and associated deposition methods and inert gas treatments that may be applied on a sheet, a carrier, or both, to control van der Waals, hydrogen and covalent bonding between a sheet and carrier. The modification layers bond the sheet and carrier together such that a permanent bond is prevented at high temperature processing as well as maintaining a sufficient bond to prevent delamination during high temperature processing.