BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING

BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING

An abrasive article configured to grind a workpiece having a fracture toughness of at least about 5.5 MPa·m0.5 may include a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body comprises a ratio of VAG/VBM of at least about 1.3, wherein VAG is a v...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lane, William H, Ramanath, Srinivasan, Hitchiner, Michael P, Upadhyay, Rachana
Format: Patent
Sprache:eng
Schlagworte:
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Beschreibung
Zusammenfassung:An abrasive article configured to grind a workpiece having a fracture toughness of at least about 5.5 MPa·m0.5 may include a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body comprises a ratio of VAG/VBM of at least about 1.3, wherein VAG is a volume percent of abrasive particles within a total volume of the body and VBM is a volume percent of bond material within the total volume of the body, and wherein the abrasive particles have an average particle size of at least about 1 micron and not greater than about 20 microns.